Turing L256 Uncooled Infrared Core Module incorporates an advanced 256×192 wafer-level detector, featuring an 18×18mm integrated design that redefines industry benchmarks for Size, Weight, and Power (SWaP³) in OEM core components. This breakthrough delivers an exceptional miniaturized solution for consumer-grade applications.
Apr, 09, 2025
Mar, 10, 2025